The vertical integration of electronic components in a package (System-in-Package) is among the most seminal developments in modern micro-electronics. In this project we develop the necessary scientific principles for an automated design of vertically integrated systems. The placement problem is a 3D-packing problem with very complex constraints which depend on the different technologies for integration. The main objectives are:

• Systematization and analytical description of technologies for integration
• Development of multicriteria optimization models and algorithms for an automated placement
• Implementation of a TEPLAVIUS-demonstrator incorporating the algorithms and the visualization of results