The vertical integration of electronic parts in a package (System-in-Package, SiP) is one of the most promising developments in modern micro-electronics. The cooperative project Versiplektor, funded by the Federal Ministry of Education and Research, aims at the development of the methodological foundations for an algorithm-based and technology-aware design of vertically integrated systems. These will be integrated exemplary in commercially available eCAD tools taking into account the major aspects of technology and production.

• Parametrization and modelling of the available 2.5d packaging technology
• eCAD "integration assistant" as a prototype for a novel design tool for vertical SiP
• example application in industry-near production for the verification of the developed tool